Finland-based TactoTek Oy has been named the recipient of Frost & Sullivan’s 2021 European Structural Electronics New Product Innovation Award. The company was recognised for its In-Mold Structural Electronics (IMSE) technology, a solution which integrates and encapsulates printed electronics and standard electronic components within durable 3D injection-moulded plastics. The technology reduces the material and energy use to improve industrial resource sustainability, while at the same time providing enhanced aesthetics and performance.
Each year, Frost & Sullivan presents this award to the company that has developed an innovative element in a product by leveraging leading-edge technologies. The award recognises the value-added features/benefits of the product and the increased return on investment (ROI) it gives customers.
In the case of structural parts produced using TactoTek’s IMSE technology, the benefits are manifold, according to Industry analyst Mike Valenti.
“TactoTek IMSE structures are thin, typically 2mm-4mm wall thickness, and can conform to complex shapes and, thus, can deliver electronic functionality in locations difficult or prohibitive for conventional electronics,” he said.
The technology allows a reduction of plastics use by up to 70% and of greenhouse gas emissions by up to 35%. The cumulative effect of reducing the amount of materials, value and mass of parts further reduces the environmental impact of up- and downstream logistics. Also, simulation processes are to reduce the number of prototypes required to prepare an IMSE part, making it ready for serial production.
A key advantage is the fact that are able to integrate mechanical structure, cosmetic surfaces, and electronic functions such as lighting, touch controls and antennas, into the thin wall thickness, reducing assembly depth by up to 90% and making it easier to integrate electronic features into tight spaces, Valenti added. Cosmetic, and electronic functions can be integrated into a single, seamless piece.
As Valenti said: "The IMSE technology effectively converts individual thin films, adhesives, and electronic parts into a single part that is lightweight, durable, and delivers reduced total cost of ownership while providing engineers greater design freedom."